High die stack package with secondary interposer

A die stack package, comprising:

• a main substrate;
• a first die stack carried by the main substrate;
• a second die stack carried by the main substrate, wherein the first and second die stacks cascade upward and toward one another;
• a secondary substrate carried by the first die stack and the second die stack;
• a third die stack carried by the secondary substrate;
• and
• a fourth die stack carried by the secondary substrate, wherein the third and fourth die stacks cascade upward and away from one another.

A method for manufacturing a die stack package, the method comprising:

• attaching a first plurality of dies on a main substrate to form a first die stack and a second die stack thereon;
• attaching a second plurality of dies on a carrier to form a third die stack and a fourth die stack thereon;
• attaching the third die stack and the fourth die stack on a secondary substrate;
• attaching the secondary substrate on the first die stack and the second die stack;
• and
• removing the carrier.