Structure and formation method of integrated chips package with thermal conductive element

A method for forming a package structure, comprising:

• forming a plurality of patterned material elements over a carrier substrate, wherein the patterned material elements are more thermal conductive than copper;
• forming a protective layer laterally surrounding each of the patterned material elements;
• and
• bonding a chip-containing structure to a first patterned material element of the patterned material elements through dielectric-to-dielectric bonding and metal-to-metal bonding.

A package structure, comprising:

• a first chip-containing structure;
• a second chip-containing structure over the first chip-containing structure;
• a material layer between the first chip-containing structure and the second chip-containing structure, wherein the material layer has a thermal conductivity greater than 400 W/mK;
• and
• a protective layer laterally surrounding the material layer.