Composite component

Abstract

A composite component containing one or more electronic components. The composite component includes a Si base layer having a first main surface, and a second main surface facing the first main surface, a redistribution layer disposed on the first main surface, a through-Si via extending through the Si base layer and the adhesive layer to electrically connect the redistribution layer and the electronic component, and extending through the Si base layer, an electronic component electrically connected to the through-Si via, and disposed on the second main surface, sidewall portions surrounding the electronic component, and disposed to form a recessed portion together with the Si base layer, and a resin sealing portion sealing the electronic component.

Dependencies are inferred from the claim text.