Stacked structures for semiconductor packages and methods of forming same

A package comprising:

• a multi-stack core substrate comprising a first core substrate bonded to a second core substrate by an adhesive layer;
• a first layer of insulating film within the first core substrate and laterally surrounded by the first core substrate;
• a first component within the first layer of insulating film and laterally surrounded by the first layer of insulating film;
• and
• a through via extending through the multi-stack core substrate.

A method comprising:

• forming a cavity extending through a first core substrate;
• placing a die within the cavity, wherein die is separated from the first core substrate;
• forming an insulating film over the first core substrate and the die, wherein the insulating film fills the cavity;
• forming a first adhesive material on the first core substrate and the die;
• bonding a second core substrate to the first adhesive material;
• forming a through via extending through the insulating film, the first core substrate, the first adhesive material, and the second core substrate;
• forming a first routing layer on the insulating film and the die;
• and
• forming a second routing layer on the second core substrate.