Semiconductor device and semiconductor module

A semiconductor module comprising:

• a semiconductor device that includes:
• a semiconductor element having a front surface, a rear surface positioned opposite the front surface, and a side surface connecting the front surface and the rear surface;
• a conductive member having an upper surface that is joined to the rear surface of the semiconductor element and a lower surface that is opposite the upper surface;
• a first sealing member covering the side surface of the semiconductor element and a part of the conductive member;
• and
• a rewiring layer including an insulating layer, a first electrode, a second electrode, a first externally-exposed layer, and second externally-exposed layer, the insulating layer covering the front surface of the semiconductor element and a part of the first sealing member, the first electrode and the second electrode being connected to the semiconductor element, the first externally-exposed layer being conductive and covering a portion of the first electrode that is exposed from the insulating layer, the second externally-exposed layer being conductive and covering a portion of the second electrode that is exposed from the insulating layer;
• a first heat sink connected to a rear surface of the semiconductor device through a joining material;
• a second heat sink connected to a front surface of the semiconductor device through the joining material and electrically connected to the first externally-exposed layer and the first electrode through the joining material;
• a lead frame connected to the second externally-exposed layer through the joining material;
• and
• a second sealing member covering the semiconductor device, a part of the first heat sink, a part of the second heat sink, a part of the lead frame, and the joining material, wherein
• an end of the second electrode that is positioned opposite the semiconductor element is extended to a portion of the rewiring layer that is positioned outside an outline of the semiconductor element,
• the second externally-exposed layer covers a portion of the second electrode that is positioned outside the outline of the semiconductor element,
• a partial region of the semiconductor device that includes the second externally-exposed layer is positioned outside an outline of the second heat sink.