Programmable dielectrophoretic semiconductor chip, packaging structure and control system thereof

Abstract

The present inventive concept discloses a programmable dielectrophoretic semiconductor chip, which comprises a microelectrode. The microelectrode comprises: a surface; a top electrode provided close to the surface; a first logic circuit used to receive and store a pattern signal; and a second logic circuit is used to receive a first analog signal and a second analog signal which are input from an external part of the microelectrode, wherein the second logic circuit is used to choose the first analog signal or the second analog signal according to the pattern signal which is received by the first logic circuit, and a voltage of the top electrode changes with the first analog signal or the second analog signal. The semiconductor chip of the present inventive concept is capable to move or position a specific single particle. In addition, the present inventive concept further provides a packaging structure with semiconductor chip and a control system of the semiconductor chip.

Dependencies are inferred from the claim text.