Deposition apparatus and deposition method using the same

A deposition apparatus comprising:

• a support, which is disposed on a bottom surface of a substrate to overlap an edge of the substrate in a plan view;
• a clamp disposed on the support to overlap the edge of the substrate;
• and
• an electrostatic chuck comprising a flat part and a plurality of protrusions, wherein the flat part is configured to be disposed on a top surface of the substrate and the plurality of protrusions extend from the flat part,
• wherein a part of the clamp is disposed between protrusions adjacent to each other among the plurality of protrusions, and
• a bottom surface of each of the plurality of protrusions has a stepped portion.

A deposition method comprising:

• placing a substrate between a support and a clamp to fix the substrate;
• moving an electrostatic chuck, which is disposed on the support and the clamp, downward to be disposed adjacent to a top surface of the substrate;
• moving the electrostatic chuck downward to be disposed directly on the top surface of the substrate;
• and
• moving the support, the clamp, and the electrostatic chuck downward so that the substrate is disposed directly on a top surface of a mask disposed below the support,
• wherein the electrostatic chuck comprises:
• a flat part having a major surface parallel to a plane defined by a first direction and a second direction intersecting the first direction;
• and
• a plurality of protrusions extending from an edge of the flat part in the first direction and overlapping an edge of the substrate in a direction perpendicular to the plane,
• wherein a groove is defined in a bottom surface of each of the plurality of protrusions, which overlaps the edge of the substrate in the direction perpendicular to the plane.