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US 2026/0008948 A1Published application
Polishing liquid, polishing liquid set, polishing method, component production method, and semiconductor component production method
OwnerYuto KURATAinventor
Life of this patent
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Abstract
A polishing liquid containing: abrasive grains; an additive; and water, in which the additive includes (A1) a polyglycerol having a weight average molecular weight of 350 to 2800 and (B) a compound having two or more nitrogen atoms to which a hydroxyalkyl group is bonded. A polishing liquid containing: abrasive grains; an additive; and water, in which the additive includes (A2) a polyglycerol having a hydroxyl value of 800 to 1000 mgKOH/g and (B) a compound having two or more nitrogen atoms to which a hydroxyalkyl group is bonded.
Claims26
A polishing liquid comprising:
- abrasive grains;
- an additive;
- and water, wherein
- the additive includes (A1) a polyglycerol having a weight average molecular weight of 350 to 2800 and (B) a compound having two or more nitrogen atoms to which a hydroxyalkyl group is bonded.
1 more element
A polishing liquid comprising:
- abrasive grains;
- an additive;
- and water, wherein
- the additive includes (A2) a polyglycerol having a hydroxyl value of 800 to 1000 mgKOH/g and (B) a compound having two or more nitrogen atoms to which a hydroxyalkyl group is bonded.
1 more element
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Dependencies are inferred from the claim text.