Semiconductor device

A semiconductor device comprising a first chip and a second chip, wherein each chip includes a high-side pad configured to be applied with a high-side voltage, a low-side pad configured to be applied with a low-side voltage lower than the high-side voltage, two or more control pads, an input pad configured to be applied with an input signal to the semiconductor device, an output pad configured to be applied with an output signal to outside of the semiconductor device, and a functional circuit that is a circuit connected to the input pad and the output pad, and is configured to operate on the basis of the high-side voltage and the low-side voltage,

• in each chip, the two or more control pads are each pulled down to the low-side voltage or pulled up to the high-side voltage,
• in each chip, the two or more control pads include a target control pad configured to receive an external control signal from outside of the semiconductor device, and
• in each chip, an internal control signal is generated on the basis of two or more signals applied to the two or more control pads, and an operation of the functional circuit is controlled on the basis of the internal control signal.