Modular packaging system for packaging of medical articles and modules for a modular packaging system for medical articles

A main module for a modular packaging system for packaging of medical articles, wherein the main module comprises:

• a main control unit (mCU),
• a mounting backbone structure configured to receive a plurality of sub-modules (120_1-120_n),
• a plurality of main-module communication interfaces (I_1m-I_nm), each associated with
• a specific order position of a respective sub-module (120_1-120_n) received on the mounting backbone structure,
• the main control unit (mCU) is configured to receive a sub-module identification via the main-module communication interfaces (I_1m-I_nm), and the sub-module identification at least gives access to at least one dimensional parameter (X, Y, Z) of a respective sub-module (120_1-120_n).

A modular packaging system for packaging of medical articles, comprising a main module and at least one sub-module (120_1-120_n), wherein the main module comprises:

• a main control unit (mCU),
• a mounting backbone structure configured to receive a plurality of sub-modules (120_1-120_n),
• a plurality of main-module communication interfaces (I_1m-I_nm), each associated with a specific order position of a respective sub-module (120_1-120_n) received on the mounting backbone structure,
• and wherein the at least one sub-module (120_1-120_n) comprises:
• at least one machine part for performing at least one function in the modular packaging system,
• a seat for positioning the sub-module (120_1-120_n) upon the mounting backbone structure of the main-module,
• a sub-module communication interface (I_1s-I_ns) for communicating with the main module, and at least configured to communicate a sub-module identification via the main-module communication interfaces (I_1m-I_nm), and the sub-module identification at least gives access to at least one dimensional parameter of a respective sub-module (120_1-120_n), and wherein
• at least one sub-module (120_1-120_n) seat is seated upon the mounting backbone structure of the main module, and wherein
• the sub-module communication interfaces (I_1s_I_ns) and the main-module communication interfaces (I_1m-I_nm) are connected to one another and
• the main control unit (mCU) is configured to receive the sub-module identification via the main-module communication interfaces (I_1m-I_nm), and the sub-module identification at least gives access to at least one dimensional parameter of a respective sub-module (120_1-120_n), via the main-module communication interfaces (I_1m-I_nm).

A method for positioning a sub-module (120_1-120_n) in relation to a main module in a modular packaging system, wherein the method comprises:

• detecting a first sub-module through a the first positioned main-module communication interface,
• detecting a sub-module identification, from the first sub-module,
• accessing at least one dimensional parameter of the first sub-module, and
• positioning the first sub-module in relation to the main module.