Frontside feedthrough connections
AssigneeIntel Corporation
InventorsSaurabh Acharya, Leonard Guler, Charles Henry Wallace
Life of this patent
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Abstract
Semiconductor devices and systems with conductive feedthroughs, and methods of forming the same, are disclosed herein. In one example, a semiconductor device includes a first interconnect, a second interconnect, and a layer between the first and second interconnects. The layer between the interconnects includes epitaxial structures and a conductive feedthrough. The conductive feedthrough extends through the layer and electrically couples the first and second interconnects, and one or more of the epitaxial structures are truncated by the conductive feedthrough.
Claims20
A semiconductor device, comprising:
- a first interconnect;
- a second interconnect;
- and
- a layer between the first and second interconnects, wherein the layer comprises a plurality of epitaxial structures and a conductive feedthrough, wherein the conductive feedthrough extends through the layer and electrically couples the first and second interconnects, wherein one or more of the epitaxial structures are truncated by the conductive feedthrough.
An electronic device, comprising:
- a first interconnect;
- a second interconnect;
- and
- a device layer between the first and second interconnects, wherein the device layer comprises a plurality of transistors and a plurality of conductive feedthroughs, wherein the conductive feedthroughs extend through some of the transistors, and wherein the conductive feedthroughs electrically couple the first and second interconnects.
A method, comprising:
- receiving a substrate;
- forming a device layer over the substrate, wherein the device layer comprises a plurality of transistors;
- forming one or more conductive feedthroughs in the device layer, wherein one or more of the transistors are truncated by the conductive feedthroughs;
- forming a first interconnect over the device layer;
- and
- forming a second interconnect under the device layer, wherein the second interconnect is electrically coupled to the first interconnect via the conductive feedthroughs.
Dependencies are inferred from the claim text.