Cooling Apparatus And Method Of Manufacturing A Cooling Apparatus

A cooling apparatus for a chip package, comprising:

• a cooling device;
• a thermal interface material layer between the cooling device and a chip;
• and
• a thermal enclosure fixed between the cooling device and the chip surrounding the thermal interface material, the thermal enclosure including a divider configured to provide a first and a second section within the thermal enclosure.

A cooling apparatus for a chip package, comprising:

• a cooling device;
• a thermal interface material layered on an upper surface of a chip;
• and
• a thermal enclosure fixed between the cooling device and the upper surface of the chip, the thermal enclosure including a cavity;
• wherein the cavity is configured to accommodate the thermal interface material.

A method of manufacturing a cooling apparatus, comprising:

• applying a thermal interface material layer on a predetermined area on a first side of a cooling device;
• attaching a thermal enclosure on the first side of the cooling device surrounding the predetermined area;
• flipping the cooling device;
• and
• installing the cooling device onto a chip, wherein the first side of the cooling device having the thermal interface material faces a top surface of the chip, thereby sandwiching the thermal interface material and the thermal enclosure between the cooling device and the chip.