Housing Packaging Structure, Packaging Assembly, and Electronic Device

A packaging assembly comprising:

• a signal transmission device;
• and
• a housing packaging structure configured to package the signal transmission device, wherein the housing packaging structure comprises:
• a packaging housing;
• a thermally conductive portion connected to the packaging housing to form a sealed cavity, wherein the sealed cavity is configured to accommodate the signal transmission device, and wherein a first thermal conductivity coefficient of the thermally conductive portion is greater than a second thermal conductivity coefficient of the packaging housing;
• an electrical connector disposed through the packaging housing and comprising:
• a first end configured to be electrically connected to the signal transmission device;
• and
• a second end located outside the sealed cavity;
• and
• a transparent portion integrally formed with the packaging housing.

An electronic device comprising:

• a body;
• and
• a packaging assembly comprising:
• a signal transmission device;
• and
• a housing packaging structure comprising:
• a packaging housing connected to the body;
• a thermally conductive portion connected to the packaging housing to form a sealed cavity, wherein the sealed cavity is configured to accommodate the signal transmission device, and wherein a first thermal conductivity coefficient of the thermally conductive portion is greater than a second thermal conductivity coefficient of the packaging housing;
• an electrical connector disposed through the packaging housing and comprising:
• a first end configured to be electrically connected to the signal transmission device;
• and
• a second end located outside the sealed cavity and electrically connected to the body;
• and
• a transparent portion integrally formed with the packaging housing.