Converting processing dimensions of a wafer package
OwnerAnkur Aggarwal, Anmol Rathi +1inventors
InventorsAnkur Aggarwal, Anmol Rathi, Suresh Venkata Pothukuchi
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Abstract
The present disclosure relates to packaging techniques in connection with packaging electrical and optical components within circuit packages. For example, one or more examples described herein involve producing or manufacturing wafers having circuit packages formed thereon. Techniques described herein related to modifying a dimension of wafers in order that the wafers conform to a nominal dimension, such that the wafers may be implemented in connection with processing equipment that is specifically configured to operate on wafers of the nominal dimension.
Claims27
A method of modifying a base dimension of a wafer structure, comprising;
- obtaining a photonic integrated circuit (PIC) wafer having a first base dimension, the PIC wafer comprising:
- a region near a top surface of the PIC wafer designed to allow light to enter and exit the PIC wafer;
- optical transmitter and receiver portions in optical communication with the region, the optical transmitter and receiver portions having electrical interconnects to the top surface of the PIC wafer in a portion that does not extend into the region;
- disposing one or more electronic components on the PIC wafer, the one or more electronic components including electrical transmitter and receiver portions interconnected with the optical transmitter and receiver portions via electrical interconnects, forming electro-optical paths to and from the one or more electronic components to region;
- positioning the PIC wafer over a base plate having a second base dimension that is larger than the first base dimension, wherein the PIC wafer covers only a portion of a top surface of the base plate such that a peripheral portion of the top surface of the base plate is exposed around a perimeter of the PIC wafer;
- and
- depositing a peripheral overmold over the PIC wafer, the one or more electronic components, and the exposed portion of the base plate around the perimeter of the PIC wafer to form a molded wafer package having the second base dimension.
A method of modifying a base dimension of a wafer structure, comprising:
- obtaining a wafer package having a first base dimension and comprising:
- a wafer having the first base dimension and having a plurality of first electrical connections on a top surface of the wafer;
- and
- one or more electronic components having a plurality of second electrical connections on a bottom surface thereof, and being positioned on the top surface of the wafer such that there are electrical couplings between the plurality of first electrical connections and the plurality of second electrical connections;
- positioning the wafer package over a base plate having a second base dimension that is larger than the first base dimension, wherein the wafer package covers only a portion of a top surface of the base plate such that a peripheral portion of the top surface of the base plate is exposed around a perimeter of the wafer package;
- and
- depositing a peripheral overmold over the wafer, the one or more electronic components, and the exposed portion of the base plate around the perimeter of the wafer package to form a molded wafer package having the second base dimension.
A method of modifying a base dimension of a wafer structure, comprising:
- obtaining a wafer package having a first base dimension and comprising:
- a wafer having a first base dimension and having a plurality of first electrical connections on a top surface of the wafer;
- and
- one or more electronic components having a plurality of second electrical connections on a bottom surface thereof, and being positioned on the top surface of the wafer such that there are electrical couplings between the plurality of first electrical connections and the plurality of second electrical connections;
- positioning the wafer package within a peripheral wafer having a second base dimension that is larger than the first base dimension, wherein peripheral wafer includes a cutout, the cutout having a size and shape corresponding to the first base dimension such that the wafer package fits within the cutout;
- depositing a peripheral overmold over at least a cutout portion of the peripheral wafer such that the overmold is deposited over the wafer and the one or more electronic components, wherein the overmold connects the wafer and the peripheral wafer to form the molded wafer package having the second base dimension.
Dependencies are inferred from the claim text.