Laser process to enhance the wire bonding process

A laser process to enhance the wire bonding process, the process steps comprising:

• a). Provide a laser processing system with a laser source;
• b). Provide a wire;
• c). Before wire bonding, use the laser processing system to clean the surface where the wire and a substrate are to be joined;
• d). Use the laser processing system, the laser source uses a blue laser with a laser source wavelength range of 400 nm to 500 nm, to form a molten pool at the joint position, the blue laser includes using 200 to 300 watts (W) of energy to locally heat the substrate for 2 to 3 milliseconds (ms), the molten pool is a circular concave arc with a maximum diameter of 330 μm to 360 μm and a maximum depth of 67 μm to 77 μm;
• and
• e). Finally, wire bonding is used to bond the wire to the substrate, so the wire is fused with the substrate, and after joining, the wire is higher than the substrate to form a ball, so that a joint end of the wire is completely covered in the molten pool.