Electroplating wafer seal apex cleaning tool

Abstract

A cleaning apparatus for semiconductor equipment, the apparatus including a cleaning head having an attachment configured for removing contamination off an electroplating seal, the attachment including a base, a first protrusion located on a first side of the base, and a second protrusion located on a second side of the base opposite the first side, where the second protrusion comprises a flat portion and a sloped portion, wherein the second protrusion is configured to push an apex of the electroplating seal, and where the apex of the electroplating seal is configured for rotationally sliding along the second protrusion.

Dependencies are inferred from the claim text.