Guide apparatus, method for manufacturing same and method for using same

A method for manufacturing a guide apparatus, comprising:

• immersing a first section of an etchable blank into an etchant, and performing a first electrochemical etching on the first section, so as to obtain a semi-finished product with one step structure;
• and
• immersing a first sub-section at an end of the first section into the etchant, and performing a second electrochemical etching on the first sub-section, so as to obtain the guide apparatus with two step structures,
• wherein an implantation section of the guide apparatus is obtained on the first section, the implantation section having a first portion corresponding to the first sub-section and a second portion corresponding to the rest of the first section except for the first sub-section, the first portion being thinner than the second portion.

A method for manufacturing a guide apparatus, comprising:

• immersing a first sub-section at an end of a first section of an etchable blank into an etchant, and performing a first electrochemical etching on the first sub-section, so as to obtain a semi-finished product with one step structure;
• and
• immersing the first section into the etchant, and performing a second electrochemical etching on the first section, so as to obtain the guide apparatus with two step structures,
• wherein an implantation section of the guide apparatus is obtained on the first section, the implantation section having a first portion corresponding to the first sub-section and a second portion corresponding to the rest of the first section except for the first sub-section, the first portion being thinner than the second portion.

A method for guiding a wire electrode, comprising:

• placing, at a first position, the wire electrode with a through hole provided at an end portion thereof;
• aligning a guide apparatus with the through hole, wherein the guide apparatus comprises, in a length direction thereof, a first portion at a front end and a second portion connected to the first portion, a maximum outer diameter size of the first portion being smaller than a size of the through hole and a minimum outer diameter size of the second portion being larger than the size of the through hole, wherein the second portion and the first portion are connected via a step structure;
• moving the guide apparatus forward so that the first portion passes through the through hole and the end portion of the wire electrode is stopped at the step structure due to pressure from the step structure in a longitudinal direction of the guide apparatus;
• and
• moving the guide apparatus to guide at least the end portion of the wire electrode from the first position to a second position.

A method for using a guide apparatus, comprising:

• bringing the guide apparatus close to an engagement part of a wire electrode, wherein the guide apparatus comprises a thinner first portion at a front end, a thicker second portion adjoining a rear of the first portion, and a transition portion connecting the first portion and the second portion, wherein the first portion is constructed to be able to pass through the engagement part, and the second portion is constructed to be unable to pass through the engagement part;
• passing the first portion through the engagement part of the wire electrode, and stopping the engagement part of the wire electrode at the transition portion;
• and
• guiding the wire electrode using the guide apparatus.