Lamination apparatus
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Ting Chiu, Ying-Jui Huang, Chien-Ling Hwang, Ching-Hua Hsieh
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Abstract
A method for laminating a film to a wafer and apparatus for performing the lamination process are disclosed. The method includes providing the wafer and the film in a process chamber where the wafer and the film are separated from each other, achieving a vacuum state and a process temperature in the process chamber, and laminating the film to contact a surface of the wafer.
Claims20
An apparatus for performing a lamination process, comprising:
- a process chamber comprising an upper chamber, a lower chamber, and an inner space between the upper chamber and the lower chamber, the lower chamber operable to support a substrate and the upper chamber operable to carry a process film to be laminated on the substrate;
- and
- a silicone rubber configured to the upper chamber of the process chamber, wherein the process film is adhered to a flat and smooth surface of the silicone rubber.
An apparatus for laminating a process film onto a substrate, comprising:
- a process chamber comprising a first portion and a second portion, wherein the first portion is configured to support the substrate;
- and
- a silicone rubber, located on the second portion of the process chamber, wherein the process film is positioned through a surface adhesion between the process film and the silicone rubber.
An apparatus for laminating a process film onto a substrate, comprising:
- a process chamber;
- a substrate pedestal, located on a first side of the process chamber, wherein the substrate pedestal is configured to support the substrate;
- a silicone rubber, located on a second side of the process chamber, wherein the process film is adhered to the silicone rubber, wherein the silicone rubber includes an anti-electrostatic-type rubber, a room-temperature-vulcanizing rubber, or a fluororubber.
Dependencies are inferred from the claim text.