Wire bonding systems and arrays, and related methods
AssigneeKulicke and Soffa Industries, Inc.
InventorMichael Christopher Lamarra
Life of this patent
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Abstract
A wire bonding array is provided. The wire bonding array includes a plurality of wire bonding systems, each of the plurality of wire bonding systems including (i) an input workpiece handling system and (ii) a bond head assembly configured to carry a wire bonding tool. The wire bonding array also includes a robot configured to provide workpieces to the input workpiece handling system of each of the plurality of wire bonding systems, the robot including a carriage for moving with respect to the plurality of wire bonding systems, the carriage being positioned above a receiving portion of the input workpiece handling system.
Claims20
A wire bonding array comprising:
- a plurality of wire bonding systems, each of the plurality of wire bonding systems including (i) an input workpiece handling system and (ii) a bond head assembly configured to carry a wire bonding tool;
- and
- a robot configured to provide workpieces to the input workpiece handling system of each of the plurality of wire bonding systems, the robot including a carriage for moving with respect to the plurality of wire bonding systems, the carriage being positioned above a receiving portion of the input workpiece handling system.
A wire bonding array comprising:
- a plurality of wire bonding systems, each of the plurality of wire bonding systems including (i) an input magazine handler, (ii) an output magazine handler;
- and (iii) a bond head assembly configured to carry a wire bonding tool;
- a robot configured to (i) provide magazines including workpieces to the input magazine handler of each of the plurality of wire bonding systems and (ii) remove magazines including workpieces from the output magazine handler, the robot including a carriage for moving with respect to the plurality of wire bonding systems, the carriage being positioned above a receiving portion of the input magazine handler;
- and
- a robot support structure, the carriage being configured to move with respect to the plurality of wire bonding systems along the robot support structure.
A method of operating a wire bonding array comprising the steps of:
- (a) providing a plurality of wire bonding systems, each of the plurality of wire bonding systems including (i) an input workpiece handling system and (ii) a bond head assembly configured to carry a wire bonding tool;
- (b) moving a robot on a carriage with respect to the plurality of wire bonding systems, the carriage being positioned above a receiving portion of the input workpiece handling system;
- and
- (c) providing workpieces to the input workpiece handling system of each of the plurality of wire bonding systems using the robot.
Dependencies are inferred from the claim text.