Back to results
US 2025/0353142 A1Published application
Polishing pad conditioning apparatus
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCheng-Ping CHEN, Shih-Chung CHEN, Sheng-Tai PENG, Hung-Lin CHEN
Life of this patent
Estimating the term…
Abstract
A polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber.
Claims20
A method for manufacturing a semiconductor wafer polishing pad, comprising:
- forming a plurality of protrusions, each of the plurality of protrusions comprising a fiber and a polymer structure surrounding the fiber and having the fiber protruding above a top surface of the polymer structure;
- and
- arranging the plurality of protrusions into clusters on a base such that each of the clusters comprises a set of the plurality of protrusions defining a concentric ring and a center protrusion disposed at an axial center of the concentric ring.
A method for manufacturing a semiconductor wafer polishing pad, comprising:
- forming a plurality of protrusions, each of the plurality of protrusions comprising a fiber and a polymer structure surrounding the fiber and having the fiber protruding above a top surface of the polymer structure;
- and
- arranging the plurality of protrusions into clusters on a base such that a first subset of the clusters defines in an ellipse around a center portion of the base.
A method for manufacturing a semiconductor wafer polishing pad, comprising:
- forming a plurality of protrusions, each of the plurality of protrusions comprising a fiber and a polymer structure surrounding the fiber and having the fiber protruding above a top surface of the polymer structure;
- and
- arranging the plurality of protrusions into clusters on a base, wherein a first subset of the clusters extend radially from a center of the base towards an edge of the base such that a line extending from the center of the base intersects a center protrusion of each cluster of the first subset of the clusters.
Dependencies are inferred from the claim text.