Source material collection system, substrate processing apparatus, source material collection method and method of manufacturing semiconductor device

A substrate processing apparatus comprising:

• a process chamber in which a substrate disposed therein is processed;
• a metal-containing gas supplier configured to supply a process gas containing a metal-containing source material into the process chamber;
• and
• a source material collection system configured to collect the metal-containing source material from the process gas exhausted from the process chamber by a pump,
• wherein the source material collection system comprises:
• an exhaust pipe through which the process gas exhausted by the pump is guided;
• a trap structure provided in a first exhaust line constituting the exhaust pipe and configured to recover the metal-containing source material from the process gas;
• and
• a heating structure configured to heat the trap structure in accordance with a viscosity of the metal-containing source material.

A source material collection method comprising:

• (a) exhausting a process gas containing a metal-containing source material from a process chamber through an exhaust pipe;
• (b) collecting the metal-containing source material from the process gas by a trap structure provided in a first exhaust line constituting the exhaust pipe;
• and
• (c) heating a trap structure by a heating structure in accordance a viscosity of the metal-containing source material and dripping the metal-containing source material in the trap structure out of the trap structure.