Display panel and manufacturing method for the same

A display panel comprising:

• a circuit layer;
• and
• a light emitting element on the circuit layer,
• wherein the circuit layer comprises:
• a semiconductor pattern;
• a first insulating layer comprising a first contact hole configured to expose a portion of the semiconductor pattern;
• a plurality of first connection electrodes on the first insulating layer and electrically connected to the semiconductor pattern through the first contact hole;
• and
• a second insulating layer configured to cover the plurality of first connection electrodes and on the first insulating layer,
• wherein each of the plurality of first connection electrodes comprises:
• a first conductive layer comprising aluminum;
• and
• a second conductive layer on the first conductive layer and comprising aluminum,
• wherein the second insulating layer comprises:
• a first sub-insulating layer between a pair of adjacent first conductive layers;
• and
• a second sub-insulating layer on the first sub-insulating layer configured to cover the second conductive layer, and
• wherein the first sub-insulating layer comprises:
• a first inorganic material comprising silicon;
• and
• a first organic material.

A display panel comprising:

• a circuit layer;
• and
• a light emitting element on the circuit layer,
• wherein the circuit layer comprises:
• a semiconductor pattern;
• a first insulating layer comprising a first contact hole configured to expose a portion of the semiconductor pattern;
• a plurality of first connection electrodes on the first insulating layer and electrically connected to the semiconductor pattern through the first contact hole;
• and
• a second insulating layer configured to cover the plurality of first connection electrodes and on the first insulating layer,
• wherein each of the plurality of first connection electrodes comprises:
• a first conductive layer comprising aluminum;
• and
• a second conductive layer on the first conductive layer and comprising aluminum,
• wherein the second insulating layer comprises:
• a first sub-insulating layer between a pair of adjacent first conductive layers;
• and
• a second sub-insulating layer on the first sub-insulating layer, and
• wherein at least a portion of a bottom surface of the second conductive layer is on the first sub-insulating layer.

A method comprising:

• providing a semiconductor pattern and a first insulating layer on the semiconductor pattern;
• and
• forming a plurality of first connection electrodes on the first insulating layer and electrically connected to the semiconductor pattern;
• and
• forming a second insulating layer that covers the plurality of first connection electrodes,
• wherein the forming of the plurality of first connection electrodes and the forming of the second insulating layer comprises:
• forming a plurality of first conductive layers comprising aluminum on the first insulating layer;
• providing a filling material between the plurality of first conductive layers to form a first sub-insulating layer that covers at least a portion of a side surface of each of the first conductive layers;
• forming a plurality of second conductive layers comprising aluminum on the plurality of first conductive layers;
• and
• forming a second sub-insulating layer that covers the plurality of second conductive layers,
• wherein the filling material comprises a first inorganic material comprising silicon and a first organic material, and
• wherein the method is a method for manufacturing a display panel.

An electronic device comprising:

• a display device comprising a display panel,
• the display panel comprising:
• a circuit layer;
• and
• a light emitting element on the circuit layer,
• wherein the circuit layer comprises:
• a semiconductor pattern;
• a first insulating layer comprising a first contact hole configured to expose a portion of the semiconductor pattern;
• a plurality of first connection electrodes on the first insulating layer and electrically connected to the semiconductor pattern through the first contact hole;
• and
• a second insulating layer configured to cover the plurality of first connection electrodes and on the first insulating layer,
• wherein each of the plurality of first connection electrodes comprises:
• a first conductive layer comprising aluminum;
• and
• a second conductive layer on the first conductive layer and comprising aluminum,
• wherein the second insulating layer comprises:
• a first sub-insulating layer between a pair of adjacent first conductive layers;
• and
• a second sub-insulating layer on the first sub-insulating layer configured to cover the second conductive layer, and
• wherein the first sub-insulating layer comprises:
• a first inorganic material comprising silicon;
• and
• a first organic material.