Electronics packaging assembly for facilitating heat transfer

A method for cooling an electronics packaging assembly, the electronics packaging assembly including a housing including an electronics compartment configured to house at least one electronic component therein;

• and a cooling system extending from a first side of the housing to a second side of the housing opposite the first side, the cooling system including an air duct defining an air channel for air flow, an air duct inlet coupled to the first side of the housing, an air duct outlet coupled to the second side of the housing, and a plurality of fins exposed from the housing, a first portion of the electronics compartment coupled to a top surface of the cooling system and a second portion coupled to a bottom surface of the cooling system, the method comprising:
• transferring heat from the first portion of the electronics compartment to the cooling system;
• transferring heat from the second portion of the electronics compartment coupled to the bottom surface of the cooling system to the cooling system;
• passing air flow through the air channel;
• and
• dissipating heat, by the plurality of fins, from the electronics packaging assembly to an exterior environment via the plurality of fins.

A method for manufacturing an electronics packaging assembly, the electronics packaging assembly including a housing including an electronics compartment configured to house at least one electronic component therein;

• and a cooling system including an air duct, an air duct inlet, an air duct outlet, and a plurality of fins, the method comprising:
• disposing the cooling system within the housing such that the air duct extends from a first side of the housing to a second side of the housing opposite the first side;
• exposing the air duct inlet and the air duct outlet from the housing to define an air channel through the air duct;
• coupling a first portion of the electronics compartment to a top surface of the cooling system and a second portion to a bottom surface of the cooling system;
• and
• exposing the plurality of fins from the housing.