Package structure including photonic package and interposer having waveguide

A semiconductor package comprising:

• an interposer comprising:
• a substrate;
• a first redistribution structure over the substrate;
• and
• a first waveguide over the first redistribution structure;
• and
• a photonic package attached to the interposer, wherein the photonic package comprises:
• an electronic die;
• and
• a photonic die between the electronic die and the interposer, wherein the photonic die comprises:
• a second redistribution structure attached to the electronic die, wherein the second redistribution structure comprises layers of a first dielectric material and comprises conductive features in the layers of the first dielectric material;
• a plurality of dielectric layers attached to the interposer;
• a second waveguide in the plurality of dielectric layers, wherein the second waveguide is optically coupled to the first waveguide;
• a photonic routing structure between the second redistribution structure and the plurality of dielectric layers;
• and
• a second dielectric material laterally adjacent to the second redistribution structure, wherein the second dielectric material is different from the first dielectric material, wherein the second redistribution structure and the second dielectric material contact and extend along the photonic routing structure, wherein an upper surface of the second dielectric material distal from the substrate is level with an upper surface of the second redistribution structure distal from the substrate.

A semiconductor package comprising:

• an interposer comprising:
• a substrate;
• a first redistribution structure over the substrate;
• and
• a first waveguide over the first redistribution structure;
• and
• a photonic package attached to the interposer, wherein the photonic package comprises:
• an electronic die;
• and
• a photonic die coupled between the electronic die and the interposer, wherein the photonic die comprises a first plurality of dielectric layers and a second waveguide in the first plurality of dielectric layers, wherein the second waveguide is optically coupled to the first waveguide, wherein the second waveguide extends further from the substrate than the first waveguide, and at least a portion of the second waveguide is disposed within lateral extents of the first waveguide.