Acoustic wave device, method of manufacturing the same, and module

An acoustic wave device comprising:

• a base member provided with a first surface and a second surface and a plurality of side surfaces, the first surface and the second surface defining front and rear surfaces, respectively, the plurality of side surfaces connecting the first surface and the second surface to each other;
• a resonator arranged at the first surface;
• a signal pad and a ground pad arranged at the first surface;
• a signal pad wire extending to connect the signal pad and an end of the first surface to each other at the first surface;
• a ground pad wire extending to connect the ground pad and the end of the first surface to each other at the first surface;
• a support layer arranged at the first surface to surround the resonator;
• a cover layer connected to the first surface with the support layer being interposed, the cover layer covering the resonator;
• a plurality of conductor vias electrically connected to the signal pad and the ground pad, the plurality of conductor vias passing through the support layer and the cover layer, the plurality of conductor vias being exposed at a surface of the cover layer opposite to the base member;
• and
• a first shield film covering the plurality of side surfaces, wherein
• the ground pad wire is electrically connected to the first shield film at the end of the first surface.