Device and method of manufacturing device
AssigneeFujitsu Limited
InventorMakoto NAKAMURA
Life of this patent
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Abstract
A device includes a substrate including a first surface, a second surface opposite to the first surface, and a through hole penetrating between the first surface and the second surface, a through electrode provided in the through hole, the through electrode having a side portion along an inner wall surface of the through hole and a bottom portion connected to the side portion, a protective film provided closer to a center of the through electrode than the through hole, and a first wiring provided on the second surface of the substrate and connected to the bottom portion of the through electrode.
Claims16
A device comprising:
- a substrate including a first surface, a second surface opposite to the first surface, and a through hole penetrating between the first surface and the second surface;
- a through electrode provided in the through hole, the through electrode having a side portion along an inner wall surface of the through hole and a bottom portion connected to the side portion;
- a protective film provided closer to a center of the through electrode than the through hole;
- and
- a first wiring provided on the second surface of the substrate and connected to the bottom portion of the through electrode.
A method of manufacturing a device comprising:
- forming a through electrode in a through hole penetrating between a first surface of a substrate and a second surface opposite to the first surface, the through electrode having a side portion along an inner wall surface of the through hole and a bottom portion connected to the side portion;
- forming a protective film at a position closer to a center of the through electrode than the through hole;
- and
- forming a first wiring connected to the bottom of the through electrode on the second surface of the substrate.
Dependencies are inferred from the claim text.