Manufacturing method of package structure having grating coupler
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Wei KUO, Chewn-Pu Jou, Hsing-Kuo Hsia, Chih-Wei TSENG
Life of this patent
Estimating the term…
Abstract
A package structure comprises photonic dies and an interposer structure. Each photonic die includes a dielectric layer and a first grating coupler embedded in the dielectric layer. The interposer structure is disposed below the photonic dies. The interposer structure includes an oxide layer and a second grating coupler embedded in the oxide layer. The photonic dies are optically coupled through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.
Claims20
A manufacturing method of a package structure, comprising:
- providing a first photonic die including a first grating material layer with a first grating coupler and providing a second photonic die including a second grating material layer with a second grating coupler;
- providing a first electronic die and a second electronic die;
- stacking the first electronic die on the first photonic die to form a first stack structure;
- etching the first electronic die to form a first lens protruded from a top surface of the first electronic die;
- stacking the second electronic die on the second photonic die to form a second stack structure;
- etching the second electronic die to form a second lens protruded from a top surface of the second electronic die;
- providing an interposer structure including a third grating material layer with a third grating coupler;
- and
- connecting the first stack structure and the second stack structure to the interposer structure,
- wherein the first and second photonic dies are optically coupled through the third grating coupler of the interposer structure and the first and second grating couplers.
A manufacturing method of a package structure, comprising:
- providing a first photonic die including a first grating coupler and providing a second photonic die including a second grating coupler;
- providing a first electronic die and a second electronic die;
- bonding the first electronic die to the first photonic die to form a first stack structure;
- etching the first electronic die to form a first lens on the first electronic die;
- bonding the second electronic die to the second photonic die to form a second stack structure;
- etching the second electronic die to form a second lens on the second electronic die;
- providing an interposer structure including a third grating coupler and a first reflector structure;
- and
- connecting the first stack structure and the second stack structure to the interposer structure,
- wherein the first and second photonic dies are optically coupled through the third grating coupler of the interposer structure and the first and second grating couplers.
A manufacturing method of a package structure, comprising:
- providing a first photonic die including a first grating coupler and providing a second photonic die including a second grating coupler;
- providing a first electronic die and a second electronic die;
- bonding the first electronic die to the first photonic die to form a first stack structure;
- etching the first electronic die to form a first lens on the first electronic die;
- bonding the second electronic die to the second photonic die to form a second stack structure;
- etching the second electronic die to form a second lens on the second electronic die;
- providing an interposer including a third grating coupler, a reflector structure, and through vias extending from a top surface of the interposer to a bottom surface of the interposer;
- and
- connecting the first stack structure and the second stack structure to the interposer,
- wherein the first and second photonic dies are optically coupled through the third grating coupler of the interposer and the first and second grating couplers.
Dependencies are inferred from the claim text.