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US 2025/0259901 A1Published application
Semiconductor devices and methods of manufacturing semiconductor devices
AssigneeAmkor Technology Japan, Inc.
InventorsShojiro Hanada, Shingo Nakamura
Life of this patent
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Abstract
In one example, a semiconductor device comprises a cavity substrate comprising a base and a sidewall to define a cavity, an electronic component on a top side of the base in the cavity, a lid over the cavity and over the sidewall, and a valve to provide access to the cavity, wherein the valve has a plug to provide a seal between a cavity environment and an exterior environment outside the cavity. Other examples and related methods are also disclosed herein.
Claims1
A semiconductor device, comprising:
- a cavity substrate comprising a base and a sidewall to define a cavity;
- an electronic component on a top side of the base in the cavity;
- a lid over the cavity and over the sidewall;
- and
- a valve to provide access to the cavity, wherein the valve has a plug to provide a seal between a cavity environment and an exterior environment outside the cavity.
2 more elements
Dependencies are inferred from the claim text.