Jig and die attach apparatus for including the same

Abstract

A jig for a die attach device may include at least one mount block including at least two holding surfaces, each of the at least two holding surfaces configured to, hold a package substrate on which a semiconductor die is mounted, and rotate around a rotation shaft extending along a first horizontal direction, and a cleaning device configured to clean a target holding surface among the at least two holding surfaces, the target holding surface being a holding surface which faces the cleaning device among the at least two holding surfaces.

Dependencies are inferred from the claim text.