Multilayer substrates, power modules, and electrical systems

A power module comprising:

• a substrate comprising:
• an insulating material layer including a ceramic material;
• a first metal layer attached to the insulating material layer on a side of the insulating material layer;
• and
• a second metal layer attached to the insulating material layer on an opposite side of the insulating material layer;
• wherein the insulating material layer is configured as a plurality of segments separated from each other;
• and
• wherein a first portion of the second metal layer, for attaching a chip thereon, overlaps at least one of the plurality of segments of the insulating material layer;
• and
• the chip including a power semiconductor device;
• wherein the chip is attached to the first portion of the second metal layer of the substrate.

An electrical system comprising:

• a power module comprising:
• a substrate comprising:
• an insulating material layer including a ceramic material;
• a first metal layer attached to the insulating material layer on a side of the insulating material layer;
• and
• a second metal layer attached to the insulating material layer on an opposite side of the insulating material layer;
• wherein the insulating material layer is configured as a plurality of segments separated from each other;
• wherein a first portion of the second metal layer, for attaching a chip thereon, overlaps at least one of the plurality of segments of the insulating material layer;
• and
• wherein the chip includes a power semiconductor device;
• and
• wherein the chip is attached to the first portion of the second metal layer of the substrate.