Embedded Power Semiconductor Package with Sidewall Contacts

Abstract

A method of forming a semiconductor package includes providing a lead frame including a metal frame at least partially surrounding a central opening and a plurality of tie bars connected between the metal frame and an adjacent stabilizing metal section, arranging the lead frame on a temporary carrier, arranging a semiconductor die on the temporary carrier within the central opening, forming a dielectric material that fills the central opening and encapsulates the semiconductor die, forming a first recess in the dielectric material above the semiconductor die so as to expose a first surface of the semiconductor die, electrically connecting terminals of the semiconductor die with the metal frame, and forming exposed outer contacts of the semiconductor package from the tie bars.

Dependencies are inferred from the claim text.