Semiconductor device and airflow generating package

A semiconductor device, comprising:

• an operational component, wherein the operational component produces a heat while operating;
• and
• an airflow generating chip, disposed on, under or by the operational component, and
• configured to generate an airflow to dissipate the heat produced by the operational component.

An airflow generating package, comprising:

• a fin-type heat conductive component, wherein the fin-type heat conductive component is disposed on a heat source;
• a first airflow generating chip disposed by a first side of the fin-type heat conductive component and configured to generate an airflow inward;
• and
• a second airflow generating chip disposed by a second side of the fin-type heat conductive component and configured to generate the airflow outward;
• wherein the airflow flows through the fin-type heat conductive component and is configured to dissipate a heat from the heat source.