Channel formation in gate-all-around complementary metal-oxide-semiconductor devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJhon Jhy Liaw
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJhon Jhy Liaw
Estimating the term…
A method of forming a semiconductor device includes forming a first fin in a first region and a second fin in a second region, forming first suspended nanostructures in the first fin and second suspended nanostructures in the second fin, forming a third semiconductor layer wrapping around each of the second suspended nanostructures in the second fin, performing an anneal process to incorporate materials contained in the third semiconductor layer into the second suspended nanostructures in the second fin, such that a thickness of the second suspended nanostructures is increased to be larger than a thickness of the first suspended nanostructures, and forming a gate stack wrapping around each of the first and second suspended nanostructures.
A method of forming a semiconductor device, comprising:
A method, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.