Semiconductor Device and Method of Forming Selective Shielding Using UV Curable Ink
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsJinHee Jung, ChangOh Kim, WooSoon Kim
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AssigneeSTATS ChipPAC Pte. Ltd.
InventorsJinHee Jung, ChangOh Kim, WooSoon Kim
Estimating the term…
A semiconductor device has a substrate and an electrical component disposed over a surface of the substrate. An antenna can be formed within the substrate. An encapsulant is deposited over the surface of the substrate. An ink material is deposited over the surface of the substrate. The ink material can be a curable epoxy. The ink material is formed as a straight wall, curved wall, stepped wall, stepped convex wall, and such. The ink material can be stacked with a first ink material deposited on the surface of the substrate and a second ink material deposited over the first ink material. A shielding material is disposed over the encapsulant with the ink material blocking progression of the shielding material. An electrical connector is disposed over the surface of the substrate outside the ink material to avoid contact with the shielding material.
A semiconductor device, comprising:
A semiconductor device, comprising:
A method of making a semiconductor device, comprising:
A method of making a semiconductor device, comprising:
Dependencies are inferred from the claim text.