Thermally conductive support and assembly comprising a thermally conductive support and a packaged power device

Abstract

Various embodiments of thermally conductive support are provided. An example thermally conductive support includes a core layer, of metal, a dielectric layer, extending on a first face of the core layer and an electrical connection layer, of electrically conductive material, extending on the first dielectric layer. The dielectric layer has a through hole which exposes the core layer and is intended to be filled with an adhesive mass having an electronic power device adhering thereto, forming a device/support assembly.

Dependencies are inferred from the claim text.