Leadframe with retaining features

Abstract

A semiconductor package that includes a leadframe having retaining features adapted to receive a molding compound is provided. As one example, an IC package includes a leadframe of a conductive material including a die attach pad and a lead finger separated from an edge of the die attach pad. The leadframe has a first surface and a second surface opposite the first surface. The IC package also includes retaining features on the lead finger at the second surface. The IC package further includes a die on the first surface at the die attach pad. The IC package yet further includes a molding compound that encapsulates the leadframe and the die and extends into and/or around the retaining features.

Dependencies are inferred from the claim text.