Reconstituted passive assemblies for embedding in thick cores

An apparatus, comprising:

• a first substrate;
• a cavity through a thickness of the first substrate;
• an assembly in the cavity, wherein the assembly comprises:
• a second substrate, wherein the second substrate comprises an electrically passive device;
• a pad on the second substrate;
• and
• a first layer coupled to the second substrate, wherein the first layer directly contacts at least one surface of the second substrate;
• and
• a second layer around the assembly and in the cavity.

An apparatus, comprising:

• a board;
• a package substrate coupled to the board, wherein the package substrate comprises:
• a core with a cavity through a thickness of the core, wherein the core has a first thickness;
• an assembly embedded in the cavity, wherein the assembly has a second thickness that is substantially equal to the first thickness, and wherein the assembly comprises:
• a component substrate with an electrically passive device, wherein the component substrate comprises silicon;
• and
• a layer that directly contacts at least one surface of the component substrate, wherein the layer is an organic dielectric or an inorganic dielectric;
• and
• a die coupled to the package substrate.