Integrated circuit packages and methods

A semiconductor package comprising:

• a substrate;
• a first package component bonded to the substrate, the first package component comprising two or more semiconductor dies stacked vertically;
• and
• a first cooling system over the first package component, the first cooling system comprising:
• a first base bonded to the first package component, wherein the first base comprises a first recess and a first pin protruding from a bottom of the first recess, a second recess and a second pin protruding from a bottom of the second recess, and a first raised portion between the first recess and the second recess;
• and
• a lid attached to the first base.

A method of manufacturing a semiconductor package, the method comprising:

• bonding a material layer to a package component layer;
• removing a portion of the material layer to form a base layer, wherein the base layer comprise a first recess, a first plurality of pins protruding from a bottom of the first recess, and a first raised portion encircling the first recess in a top-down view;
• singulating the base layer and the package component layer to form a first base and a first package component, wherein the first base remains bonded to the first package component, and wherein the first base comprises the first recess, the first plurality of pins, and the first raised portion;
• bonding the first package component to a substrate;
• and
• attaching a lid to the first raised portion of the first base by a sealant, wherein the lid comprises first openings facing the first base.