Resist tenting and plating in core cavity for component attachment

An apparatus, comprising:

• a substrate;
• a cavity through a thickness of the substrate;
• a first layer that seals an opening of the cavity, wherein the first layer has a bowl shaped cross-section that extends up sidewalls of the cavity;
• a component coupled to the layer;
• and
• a second layer around the component within the cavity.

An apparatus, comprising:

• a board;
• a package substrate coupled to the board, wherein the package substrate comprises:
• a core;
• a cavity through a thickness of the core;
• a first layer that spans an opening of the cavity and extends up sidewalls of the cavity;
• and
• a component coupled to the first layer, wherein the component is at least partially within the cavity;
• and
• a die coupled to the package substrate.