Back to results
US 2025/0218872 A1Published application
Expanding device, semiconductor chip manufacturing method, and semiconductor chip
AssigneeYamaha Hatsudoki Kabushiki Kaisha
InventorYoshikuni SUZUKI
Life of this patent
Estimating the term…
Abstract
An expanding device includes a clamp unit, an expanding ring, and an imager to image an expanded state of a wafer by the expanding ring at a plurality of timings from a start of expansion of a sheet member to an end of expansion of the sheet member.
Claims12
An expanding device comprising:
- a clamp configured to hold a wafer ring structure including an elastic sheet member to which a wafer to be divided along a dividing line into a plurality of semiconductor chips has been attached;
- an expanding ring configured to divide the wafer into the plurality of semiconductor chips spaced apart from each other by expanding the sheet member while the clamp unit holds the wafer ring structure;
- and
- an imager configured to image an expanded state of the wafer by the expanding ring at a plurality of timings from a start of expansion of the sheet member to an end of expansion of the sheet member.
1 more element
A semiconductor chip manufacturing method comprising:
- forming a modified layer in a wafer including a plurality of individual semiconductor chips by emitting a laser beam to the wafer from a laser irradiator configured to emit the laser beam;
- and
- imaging, by an imager, an expanded state of the wafer by an expanding ring at a plurality of timings from a start of expansion of an elastic sheet member to which the wafer has been attached to an end of expansion of the sheet member while the expanding ring divides the wafer into the plurality of individual semiconductor chips by expanding the sheet member in a state in which a clamp configured to hold a wafer ring structure including the sheet member holds the wafer ring structure.
A semiconductor chip manufactured by an expanding device, the expanding device comprising:
- a clamp configured to hold a wafer ring structure including an elastic sheet member to which a wafer to be divided along a dividing line into a plurality of semiconductor chips has been attached;
- an expanding ring configured to divide the wafer into the plurality of semiconductor chips spaced apart from each other by expanding the sheet member while the clamp unit holds the wafer ring structure;
- and
- an imager configured to image an expanded state of the wafer by the expanding ring at a plurality of timings from a start of expansion of the sheet member to an end of expansion of the sheet member.
1 more element
Dependencies are inferred from the claim text.