Wafer processing apparatus

Abstract

The invention provides a wafer processing apparatus configured to interact with a wafer using a reactive gas. The wafer processing apparatus includes: a base having a carrying plane configured to carry the wafer, and the wafer has a first height and a second height; an air guide device disposed circumferentially above the base, there is a space between the base and the air guide device so that the reactive gas flows in the space; a first magnet disposed at a periphery of the base; a second magnet disposed at a periphery of the air guide device and opposite to the first magnet; a magnetic levitation control system electrically connected to the first magnet and controlling a magnetic force between the first magnet and the second magnet according to a difference of the second height and the first height to change a distance between the base and the air guide device.

Dependencies are inferred from the claim text.