Wafer bonding apparatus

A wafer bonding apparatus, comprising:

• a first chuck configured to suction a first wafer on a first surface of the first chuck;
• a second chuck configured to suction a second wafer on a second surface of the second chuck that faces the first surface;
• a plurality of bonding pin members in the second chuck and in a direction parallel to the second surface, the plurality of bonding pin members being configured to be individually operable;
• and
• a plurality of drivers connected to the plurality of bonding pin members, respectively, the plurality of drivers being configured to move the connected plurality of bonding pin members, respectively, in a first direction perpendicular to the second surface of the second chuck,
• wherein the second chuck comprises a plurality of vacuum openings adjacent to the plurality of bonding pin members, respectively, and vacuum pressures of the plurality of vacuum openings being configured to be individually adjustable.

A wafer boding apparatus, comprising:

• a chamber portion comprising a processing space;
• a first chuck in a first region of the processing space, the first chuck being configured to vacuum-suction a first wafer on a first surface of the first chuck;
• a second chuck configured to vacuum-suction a second wafer on a second surface of the second chuck facing the first surface;
• a plurality of bonding pin members in the second chuck in a direction parallel to the second surface, the plurality of bonding pin members being configured to be individually operable;
• and
• a plurality of drivers connected to the plurality of bonding pin members, respectively, the plurality of drivers being configured to move the plurality of bonding pin members, respectively, in a first direction perpendicular to the second surface of the second chuck,
• wherein the second chuck comprises a plurality of vacuum regions adjacent to the plurality of bonding pin members, respectively, vacuum pressures of the plurality of vacuum regions being configured to be individually adjusted, and a plurality of vacuum openings being spaced apart from each other in each vacuum region of the plurality of vacuum regions adjacent to the plurality of bonding pin members, respectively.