Configurable carrier for transfer and self-assembly of multiple integrated circuit devices

A method, comprising:

• receiving a carrier comprising a material at a first side;
• forming a mask over the first side to define a plurality of regions, and a first zone and a second zone within each region, wherein the second zone comprises a portion that surrounds the first zone;
• treating the first zones with a process to form a hydrophilic surface within the first zones;
• and
• removing the mask.

A method comprising:

• receiving a first carrier comprising a plurality of regions, each region comprising a first zone and a second zone, wherein the second zone comprises a portion that surrounds the first zone;
• providing a first liquid at the first zones;
• placing the first liquid in contact with a plurality of die on a second carrier;
• transferring the plurality of die from the second carrier to the first carrier;
• placing the plurality of die in contact with a second liquid, wherein the second liquid is at bonding location on a substrate;
• and
• transferring the plurality of die from the first carrier to the substrate.