Apparatus and method of processing substrate

Abstract

Disclosed are a substrate processing method and a substrate processing apparatus, and more particularly, a substrate processing apparatus which treats a substrate by adjusting airflow supplied to a process space. The apparatus of treating the substrate includes: a housing having an upper wall and providing an interior space; a treatment container provided in the interior space and providing a process space with an open top; a support unit for supporting a substrate within the process space; a liquid supply unit for supplying a treatment liquid on the substrate supported by the support unit; an exhaust unit for exhausting the process space; a fan for supplying descending airflow into the interior space; and an airflow distribution unit that is disposed under the fan and above the treatment container and distributes the descending airflow to the interior space, in which the airflow distribution unit is provided to distribute the descending airflow in a mode selected from a first mode and a second mode, and in the first mode and the second mode, a flow of the descending airflow is provided differently from each other.

Dependencies are inferred from the claim text.