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US 2025/0218818 A1Published application
Non-planar semiconductor packaging systems and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsMichael J. SEDDON, Francis J. CARNEY
Life of this patent
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Abstract
Implementations of a packaging system may include a wafer; and a curvature adjustment structure coupled thereto where the curvature adjustment structure may be configured to alter a curvature of a largest planar surface of the wafer.
Claims20
A method of curving a wafer, the method comprising:
- forming one or more power semiconductor devices in a wafer;
- permanently coupling a curvature adjustment structure to the wafer;
- and
- inducing a curvature of the wafer through the curvature adjustment structure.
1 more element
A method of curving a wafer, the method comprising:
- permanently bonding a mold compound to a wafer;
- and
- increasing a curvature of the wafer through the mold compound.
A method of curving a wafer, the method comprising:
- thinning a wafer;
- coupling a curvature adjustment structure to the wafer;
- one of heating or curing the curvature adjustment structure;
- and
- inducing a curvature of the wafer through one of heating or curing the curvature adjustment structure.
2 more elements
Dependencies are inferred from the claim text.