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US 2025/0218802 A1Published application
Substrate treatment system and substrate treatment method
AssigneeTokyo Electron Limited
InventorKeiichi YAHATA
Life of this patent
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Abstract
A substrate treatment system connected to an exposure apparatus, includes: a substrate treatment apparatus configured to perform a treatment on a substrate; and a first supply path connecting the substrate treatment apparatus and the exposure apparatus and configured to supply cooling water used in the substrate treatment apparatus to the exposure apparatus.
Claims9
A substrate treatment system connected to an exposure apparatus, the substrate treatment system comprising:
- a substrate treatment apparatus configured to perform a treatment on a substrate;
- and
- a first supply path connecting the substrate treatment apparatus and the exposure apparatus and configured to supply cooling water used in the substrate treatment apparatus to the exposure apparatus.
A substrate treatment method using a substrate treatment system connected to an exposure apparatus, the substrate treatment method comprising
- supplying cooling water used in a substrate treatment apparatus to the exposure apparatus.
Dependencies are inferred from the claim text.