Method for manufacturing electronic component or semiconductor device

Abstract

Provided is a new method by which it is easier to remove an element after processing, so as to improve productivity in manufacturing an electronic component or a semiconductor device. An object to be processed used in manufacturing an electronic component or a semiconductor device is attached to an uneven surface of a pressure sensitive adhesive layer. The object to be processed on the pressure sensitive adhesive layer is processed to obtain a processed product. The processed product is removed from the pressure sensitive adhesive layer.

Dependencies are inferred from the claim text.