Connector, terminal arrangement method, and electronic device

A terminal arrangement method, applied to a connector, comprising:

• a housing comprising at least one longitudinal separation rib disposed in the housing along a direction perpendicular to a length direction of the housing, wherein the at least one longitudinal separation rib separates the housing into a plurality of module cavities;
• and
• a plurality of modules in one-to-one correspondence with the plurality of module cavities, wherein each module in the plurality of modules is disposed in a module cavity in the plurality of module cavities corresponding to the module, wherein the plurality of modules are combined and then divided into at least one low-speed area and at least one high-speed area, wherein the at least one low-speed area and the at least one high-speed area are arranged in a sequence, and wherein any one of the plurality of modules comprises a plurality of terminals;
• wherein the connector comprises a plurality of low-speed signal terminals and a plurality of high-speed signal terminals, and comprises:
• a low-speed signal terminal area for arranging the plurality of low-speed signal terminals;
• and
• a high-speed signal terminal area for arranging the plurality of high-speed signal terminals,
• wherein the low-speed signal terminal area and the high-speed signal terminal area are respectively disposed at two end parts of the connector, and
• wherein the low-speed signal terminal area is adjacent to the high-speed signal terminal area.

An electronic device comprising a circuit board, a chip and a connector, comprising:

• a housing comprising at least one longitudinal separation rib disposed in the housing along a direction perpendicular to a length direction of the housing, wherein the at least one longitudinal separation rib separates the housing into a plurality of module cavities;
• and
• a plurality of modules in one-to-one correspondence with the plurality of module cavities, wherein each module in the plurality of modules is disposed in a module cavity in the plurality of module cavities corresponding to the module, wherein the plurality of modules are combined and then divided into at least one low-speed area and at least one high-speed area, wherein the at least one low-speed area and the at least one high-speed area are arranged in a sequence, and wherein any one of the plurality of modules comprises a plurality of terminals;
• wherein the chip and the connector are arranged on the circuit board, and the connector is electrically connected to the chip.