Apparatus, system, and method for balancing timing closure

A three-dimensional integrated circuit comprising:

• a base die;
• and
• a stack of at least two dies electronically coupled to an interface of the base die, wherein:
• a programmable delay element is integrated with each die to control a timing of a data signal;
• and
• at least one through-silicon via (TSV) vertically spans each die to interconnect to other dies to transmit data signals.

A method of manufacturing comprising:

• disposing a set of electronic circuits on a semiconductor material of an integrated circuit;
• forming at least one through-silicon via (TSV) to vertically span the semiconductor material, wherein the at least one TSV is configured to transmit data signals;
• and
• integrating a programmable delay element with the set of electronic circuits, wherein the programmable delay element is configured to delay data signals.