Packaging architecture for photonic components
AssigneeNokia Solutions and Networks Oy
InventorsJuthika BASAK, Abderrahim EL AMRANI
Life of this patent
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Abstract
A opto-electronic assembly, including: a photonic integrated circuit (PIC), a radio frequency integrated circuit (RFIC), a substrate, and an interposer, wherein the RFIC is mounted on the PIC and is electrically connected to the PIC, wherein the PIC is mounted and electrically connected to the substrate via the interposer.
Claims22
An opto-electronic assembly, comprising:
- a photonic integrated circuit (PIC);
- a radio frequency integrated circuit (RFIC);
- a substrate, and
- an interposer,
- wherein the RFIC is mounted on the PIC and is electrically connected to the PIC,
- wherein the PIC is mounted and electrically connected to the substrate via the interposer.
A method for assembling opto-electronic assembly, comprising a photonic integrated circuit (PIC), a radio frequency integrated circuit (RFIC), a substrate, and
- an interposer, comprising:
- bonding the RFICs to the PIC to form a first sub-assembly wherein the RFIC and the PIC are electrically connected;
- bonding the first sub-assembly to the interposer to form a second sub-assembly wherein the PIC and the RFIC are electrically connected to the interposer;
- and
- bonding the second sub-assembly to the substrate wherein the interposer is electrically connected to the substrate and wherein the substrate is electrically connected to the PIC and the RFICs via the interposer.
A method for assembling opto-electronic assembly, comprising a photonic integrated circuit (PIC), a radio frequency integrated circuit (RFIC), a substrate, and
- an interposer, comprising:
- bonding the RFIC and the interposer to the PIC to form a first sub-assembly wherein the RFIC and the PIC and the interposer are electrically connected;
- and
- bonding the first sub-assembly to the substrate wherein the interposer is electrically connected to the substrate and wherein the substrate is electrically connected to the PIC via the interposer.
Dependencies are inferred from the claim text.